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FWF25019-S13B22W1B
板装插座 2.5mm ,13位 ,90°插件 ,PA66
Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66
Product Number：FWF25019-S13B22W1B
Production Status： Active
Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66
The pictures are for reference only for installation methods, please refer to the specifications and drawings for details
Product Catalog
Connectors
Product System
Wire to Board/Wire Connector
Style
Socket
Gender
Female
Pitch
2.5mm
Row Option
Single row
Number of Positions
13Circuits
Orientation
Right angle(90°)
Colour
White
Current(Max)
3A
Voltage(Max)
250V
Contact Resistance
20 mΩ Max
Insulation Resistance
1000 MΩ Min
Withstanding Voltage
1000V AC r.m.s
Operating Temperature Range
-25ºC~+85ºC
Mounting Style
Through hole
Material-Contact
Brass
Plating
Bright tin plated
Material-Resin
PA66
Flammability Rating
UL94 V-0
Packaging
PE Bag

Product Drawings

FWF25019series.pdf

Product Specifications

FWF25019Productspecification.pdf English Version
REACH (EU REACH Regulation) Does not contain REACH SVHC (1907/2006/EC)
ROHS (EU ROHS Directive) Complies with EU Restriction of Hazardous Substances Directive 2011/65/EU (RoHS2)
ELV (EU ELV Directive) Complies with End-of-Life Vehicles Directive 2000/53/EC (ELV) substance restriction requirements
Plug
Wire to board housing 2.5mm 13Circuits
FHG25001-S13M2W1B
Wire to board housing 2.5mm 13Circuits
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Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66
FWF25019-S13B22W1B

Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66

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Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66
FWF25019-S13B22W1B

Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66

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