FWF25018 Wafer 2.5mm 180°Vertical (DIP)
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EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
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FWF25018-S04S22W1B
Wafer 2.5mm 180°Vertical 4Circuits (DIP)
Stock(pcs) 15 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-18|timezoneDate}} -
FWF25018-S05S22W1B
Wafer 2.5mm 180°Vertical 5Circuits (DIP)
Stock(pcs) 283 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-18|timezoneDate}}
- Category
- CategoryWafer 180°Vertical (DIP)
- Circuits2-16
- Pitch2.5mm
- Height7.0mm
- Electrical
- Current - Maximum per Contact3.00A
- Voltage - Maximum250V
- Contact Resistance20 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage800V AC r.m.s
- Temperature Range operating-25℃+85℃
- Material and Plating
- Material-MetalBrass
- Material - Plating MatingGold/Tin
- Material - Plating TerminationGold/Tin
- Material - ResinPA6T UL94V-0/PA66 UL94V-0
- Compatible Parts
- PulgFHG25001
- Receptacle-
- TerminalFT25001
- Assembly shell-
