FWF50809 Wafer 5.08mm 180°Vertical (DIP)
-
EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
- Category
- CategoryWafer 180°Vertical (DIP)
- Circuits4
- Pitch5.08mm
- Height11mm
- Electrical
- Current - Maximum per Contact10.00A
- Voltage - Maximum250V
- Contact Resistance25 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage1500V AC r.m.s
- Temperature Range operating-25℃+85℃
- Material and Plating
- Material-MetalPhosphor Bronze
- Material - Plating MatingTin
- Material - Plating TerminationTin
- Material - ResinPA66 UL94V-0
- Compatible Parts
- PulgFHG50801
- Receptacle-
- TerminalFT50802
- Assembly shell-
