FWF63503 Wafer 6.35mm 180°Vertical (DIP)
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EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
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FWF63503-T09S22TB
Wafer 6.35mm 180°Vertical 9Circuits (DIP)
Stock(pcs) 407 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}} -
FWF63503-T12S22TB
Wafer 6.35mm 180°Vertical 12Circuits (DIP)
Stock(pcs) 100 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}} -
FWF63503-T15S22TB
Wafer 6.35mm 180°Vertical 15Circuits (DIP)
Stock(pcs) 28 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}}
- Category
- CategoryWafer 180°Vertical (DIP)
- Circuits9,12,15
- Pitch6.35mm
- Height14.73mm
- Electrical
- Current - Maximum per Contact10.00A
- Voltage - Maximum600V
- Contact Resistance25 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage5000V AC r.m.s
- Temperature Range operating-25℃+85℃
- Material and Plating
- Material-MetalPhosphor Bronze
- Material - Plating MatingTin
- Material - Plating TerminationTin
- Material - ResinPA66 UL94V-0
- Compatible Parts
- PulgFHG63503
- Receptacle-
- TerminalFT63502
- Assembly shell-
