FWF80002 Wafer 10-8mm 180° Vertical (DIP)
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EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
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FWF80002-S01S22GYB
Wafer 10-8mm ,1Circuit ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date 2025-06-05 -
FWF80002-S02S22GYB
Wafer 10-8mm ,2Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date 2025-06-05 -
FWF80002-S03S22GYB
Wafer 10-8mm ,3Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date 2025-06-05 -
FWF80002-S04S22GYB
Wafer 10-8mm ,4Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 50000 Lead time Estimated delivery date 2025-06-05 -
FWF80002-S04S22WHB
Wafer 10-8mm ,4Circuits ,180° Vertical(DIP) ,White
Stock(pcs) 17 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-05 -
FWF80002-S05S22GYB
Wafer 10-8mm ,5Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date 2025-06-05 -
FWF80002-S06S22GYB
Wafer 10-8mm ,6Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs) 0 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date 2025-06-05
- Category
- CategoryWafer 180° Vertical (DIP)
- Circuits1-6
- Pitch8.0mm
- Height16.5mm
- Electrical
- Current - Maximum per Contact5.00A
- Voltage - Maximum250V
- Contact Resistance10 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage1500V AC r.m.s
- Temperature Range operating-25℃+85℃
- Material and Plating
- Material-MetalBrass
- Material - Plating MatingTin
- Material - Plating TerminationTin
- Material - ResinPA66 UL94V-0
- Compatible Parts
- PulgFHG80001
- Receptacle-
- TerminalFT80001
- Assembly shell-
