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FWF20018 Wafer 2mm 90°Angle (DIP)  ZIF

FWF20018 Wafer 2mm 90°Angle (DIP) ZIF

  • EU RoHS
    Compliant(2011/65/EU)

  • EU REACH
    Dose not contain REACH SVHC(1907/2006/EC)

  • EU ELV
    Compliant(2000/53/EC)

  • Category
  • CategoryWafer 90°Angle (DIP)
  • Circuits2-16
  • Pitch2.0mm
  • Height8.1mm
  • Electrical
  • Current - Maximum per Contact2.00A
  • Voltage - Maximum125V
  • Contact Resistance20 mΩ Max
  • Insulation Resistance500 MΩ Min
  • Withstanding Voltage800V AC r.m.s
  • Temperature Range operating-25℃+85℃
  • Material and Plating
  • Material-MetalBrass
  • Material - Plating MatingGold/Tin
  • Material - Plating TerminationGold/Tin
  • Material - ResinPA66 UL94V-2
  • Compatible Parts
  • PulgFHG20005
  • Receptacle-
  • TerminalFT20004
  • Assembly shell-