FWF42007 Wafer4.2mm 90°Angle (DIP)
-
EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
-
FWF42007-S02B22TK
Wafer4.2mm 90°Angle 2Circuits (DIP)
Stock(pcs) 36 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}} -
FWF42007-S03B22TK
Wafer4.2mm 90°Angle 3Circuits (DIP)
Stock(pcs) 287 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}} -
FWF42007-S04B22TK
Wafer4.2mm 90°Angle 4Circuits (DIP)
Stock(pcs) 17 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}} -
FWF42007-S05B22TK
Wafer4.2mm 90°Angle 5Circuits (DIP)
Stock(pcs) 714 Status Active MPQ 1000 MOQ 1000 Lead time Estimated delivery date when out of stock {{2026-04-15|timezoneDate}}
- Category
- CategoryWafer 90°Angle (DIP)
- Circuits2-5
- Pitch4.2mm
- Height12.45mm
- Electrical
- Current - Maximum per Contact9.00A
- Voltage - Maximum600V
- Contact Resistance10 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage1500V AC r.m.s
- Temperature Range operating-40℃+105℃
- Material and Plating
- Material-MetalBrass
- Material - Plating MatingTin
- Material - Plating TerminationTin
- Material - ResinPA66 UL94V-0
- Compatible Parts
- PulgFHG42003
- Receptacle-
- TerminalFT42001
- Assembly shell-
