FWF25003 Wafer 2.5mm 180°Vertical (DIP)

FWF25003 Wafer 2.5mm 180°Vertical (DIP)

  • EU RoHS
    Compliant(2011/65/EU)

  • EU REACH
    Dose not contain REACH SVHC(1907/2006/EC)

  • EU ELV
    Compliant(2000/53/EC)

  • Category
  • CategoryWafer 180°Vertical (DIP)
  • Circuits2-12
  • Pitch2.5mm
  • Height6.0mm
  • Electrical
  • Current - Maximum per Contact3.00A
  • Voltage - Maximum250V
  • Contact Resistance20 mΩ Max
  • Insulation Resistance1000 MΩ Min
  • Withstanding Voltage1000V AC r.m.s
  • Temperature Range operating-25℃+85℃
  • Material and Plating
  • Material-MetalPhosphor Bronze
  • Material - Plating MatingTin
  • Material - Plating TerminationTin
  • Material - ResinPA66 UL94V-2
  • Compatible Parts
  • PulgFHG25002
  • Receptacle-
  • TerminalFT25005
  • Assembly shell-