
FWF42004 Wafer 4.2mm 90°Angle (DIP)
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EU RoHS
Compliant(2011/65/EU) -
EU REACH
Dose not contain REACH SVHC(1907/2006/EC) -
EU ELV
Compliant(2000/53/EC)
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FWF42004-D02B22TK
Wafer 4.2mm 90°Angle 2Circuits (DIP)
Stock(pcs) 19 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D04B22TK
Wafer 4.2mm 90°Angle 4Circuits (DIP)
Stock(pcs) 632 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D06B22TK
Wafer 4.2mm 90°Angle 6Circuits (DIP)
Stock(pcs) 71 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D08B22TK
Wafer 4.2mm 90°Angle 8Circuits (DIP)
Stock(pcs) 376 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D10B22TK
Wafer 4.2mm 90°Angle 10Circuits (DIP)
Stock(pcs) 657 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D12B22TK
Wafer 4.2mm 90°Angle 12Circuits (DIP)
Stock(pcs) 73 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D14B22TK
Wafer 4.2mm 90°Angle 14Circuits (DIP)
Stock(pcs) 0 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date 2025-06-24 -
FWF42004-D16B22TK
Wafer 4.2mm 90°Angle 16Circuits (DIP)
Stock(pcs) 378 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D18B22TK
Wafer 4.2mm 90°Angle 18Circuits (DIP)
Stock(pcs) 19 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date when out of stock 2025-06-24 -
FWF42004-D20B22TK
Wafer 4.2mm 90°Angle 20Circuits (DIP)
Stock(pcs) 0 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date 2025-06-24 -
FWF42004-D22B22TK
Wafer 4.2mm 90°Angle 22Circuits (DIP)
Stock(pcs) 0 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date 2025-06-24 -
FWF42004-D24B22TK
Wafer 4.2mm 90°Angle 24Circuits (DIP)
Stock(pcs) 0 Status Active MPQ 500 MOQ 1000 Lead time Estimated delivery date 2025-06-24
- Category
- CategoryWafer 90°Angle (DIP)
- Circuits2,4,6,8,10,12,14,16,18,20,22,24
- Pitch4.2mm
- Height12.80mm
- Electrical
- Current - Maximum per Contact9.00A
- Voltage - Maximum250V
- Contact Resistance15 mΩ Max
- Insulation Resistance1000 MΩ Min
- Withstanding Voltage1500V AC r.m.s
- Temperature Range operating-40℃+105℃
- Material and Plating
- Material-MetalBrass
- Material - Plating MatingTin
- Material - Plating TerminationTin
- Material - ResinPA66 UL94V-0
- Compatible Parts
- PulgFHG42001
- Receptacle-
- TerminalFT42001
- Assembly shell-