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FWF20006 Wafer 2mm 90°Angle (DIP)

FWF20006 Wafer 2mm 90°Angle (DIP)

  • EU RoHS
    Compliant(2011/65/EU)

  • EU REACH
    Dose not contain REACH SVHC(1907/2006/EC)

  • EU ELV
    Compliant(2000/53/EC)

  • Category
  • Category Wafer 2mm 90°Angle (DIP)
  • Circuits4,6,8,10,12,14,16,18,20,22,24,26,28,30,32,34,36,38,40
  • Pitch2.0mm
  • Height9.5mm
  • Electrical
  • Current - Maximum per Contact3.00A
  • Voltage - Maximum250V
  • Contact Resistance10 mΩ Max
  • Insulation Resistance1000 MΩ Min
  • Withstanding Voltage800V AC r.m.s
  • Temperature Range operating-25℃+85℃
  • Material and Plating
  • Material-MetalPhosphor Bronze
  • Material - Plating MatingTin
  • Material - Plating TerminationTin
  • Material - ResinPA46/PA9T UL94V-0
  • Compatible Parts
  • PulgFHG20003
  • Receptacle-
  • TerminalFT20002
  • Assembly shell-